Broadband Electromagnetic Modelling and Stochastic Signal Analysis of Multiconductor Interconnections
Abstract: This lecture addresses the statistical modelling and simulation of high-speed interconnections with uncertain physical properties and terminations. Typical quantities of interest are S-parameters, crosstalk, Bit Error Rates and eye-diagrams. Focus is on on-board and on-chip multiconductor interconnections modelled by the telegrapher equations. First, the meaning of the classical resistance, inductance, conductance and capacitance (RLGC) per unit-of-length parameters in the presence of good conductors and semiconductors, is revisited. Next, attention is devoted to an efficient numerical approach to obtain broadband RLGC-data for arbitrary cross-sections, while accurately taking skin-effect and current crowding into account. This efficient numerical technique lays the foundation for the subsequent statistical signal analysis where stochastic variations in the physical link properties and in the load conditions are included. It is shown how Polynomial Chaos based approaches can be advantageously harnessed to beat the traditional Monte Carlo technique and how these techniques can be integrated in SPICE-compatible simulators. Finally, we consider the case in which only a limited set of measurements or simulations of a passive interconnection, exhibiting variability, are available, without any further physical or geometrical insight. It is investigated how machine learning techniques allow to create a realistic and physically consistent stochastic model of that interconnection and its signal transfer properties.
Bio: Daniël De Zutter was born in 1953. He received his M. Sc. Degree in Electrical Engineering from the University of Gent in 1976. In 1981 he obtained a Ph. D. degree and in 1984 he completed a thesis leading to a degree equivalent to the French Aggrégation or the German Habilitation. He is a full professor of electromagnetics. His research focuses on all aspects of circuit and electromagnetic modelling of high-speed and high-frequency interconnections and packaging, on Electromagnetic Compatibility (EMC) and numerical solutions of Maxwell’s equations. As author or co-author he has contributed to more than 250 international journal papers and 270 papers in conference proceedings. In 2000 he was elected to the grade of Fellow of the IEEE. Between 2004 and 2008 he served as the Dean of the Faculty of Engineering and Architecture of Ghent University and was the head of the Department of Information Technology and of its Electromagnetic Research group until February 2017.