Photo: Overbond team (left); University of Toronto software engineers (right); and University of Waterloo winner Toby Huang via video link.
June 17-19, the Computer Science Student Union (CSSU) partnered with Overbond for a simultaneous hackathon held at both the University of Toronto and the University of Waterloo. Overbond’s CEO Vuk Magdelinic is a graduate of the Edward S. Rogers Sr. Department of Electrical & Computer Engineering (ECE) and many of the company’s employees are U of T alumni.
More than 100 of the best and brightest computer science and engineering students worked in teams of two over the course of the 48-hour event, competing for a $1,000 prize.
Together, the CSSU and Overbond determined a challenging fintech simulation that allowed students to experience both the powerful capabilities of the Overbond platform and understand the problems present in the primary capital markets. Participants were asked to implement the maximum clique problem. It was a very challenging question and the students really enjoyed the experience.
“I had a great time and gained a lot of experience in hands on programming, especially with the time pressure!” said third-place winner, Lennart Döppenschmitt (MSc Mathematics). “Thank you to Overbond and the CSSU for hosting this event and making it possible.”
U of T finished second and third in the contest. Waterloo placed first by 0.04 seconds.
As a Toronto-based firm, Overbond emerged from the MaRS fintech cluster and the Communitech technology innovation super-cluster. Earlier this year, Overbond introduced Overbond BPS, a cloud-based solution that streamlines dealer-issuer communication and provides advanced market analytics.
Files from Overbond and CSSU president Hanchen Wang.